Darrin J. Young received his BS with honors, MS, and PhD degrees from the Department of Electrical Engineering and Computer Sciences at University of California at Berkeley in 1991, 1993, and 1999, respectively. His doctoral dissertation emphasizes on microelectromechanical devices design and fabrication technologies for radio frequency analog signal processing. Between 1991 and 1993, he worked at Hewlett-Packard Laboratories in Palo Alto, California, where he designed a shared memory system for a DSP-based multiprocessor architecture. During the summer of 1997, he worked at Rockwell Semiconductor Systems in Newport Beach, California, where he designed silicon bipolar RF analog circuits for cellular telephony applications. Between 1997 and 1998, he was also at Lawrence Livermore National Laboratory, working on the design and fabrication of three-dimensional RF MEMS coil inductors for wireless communications.
Dr. Young joined the Department of Electrical Engineering and Computer Science at Case Western Reserve University as an assistant professor in 1999. His research interests include MEMS and nano-electro-mechanical devices design, fabrication, and integrated analog circuits design for communications, inertial sensing, biomedical implant, and general industrial applications.
M. Suster, W. H. Ko, D. J. Young, “An Optically-Powered Wireless Telemetry Module for High-Temperature MEMS Sensing and Communication,” IEEE Journal of Microelectromechanical Systems, June 2004, pp. 536-541.
J. Du, W. H. Ko, D. J. Young, “Single Crystal Silicon MEMS Fabrication Based On Smart-Cut Technique,” Sensors and Actuators, vol. 112, issue 1, pp. 116-121, 2004.
D. J. Young, J. Du, C. A. Zorman, W. H. Ko, “High-Temperature Single Crystal 3C-SiC Capacitive Pressure Sensor,” IEEE Sensors Journal, Special Issue on Microsensors and Microactuators, August 2004, pp. 464-470.
R. Wang, W. H. Ko, and D. J. Young, “Silicon-Carbide-MESFET-Based 400oC MEMS Sensing and Data Telemetry,” to appear in IEEE Sensors Journal, 2005.
J. Guo, H. Kuo, D. J. Young, and W. H. Ko, “Buckled Beam Linear Output Capacitive Strain Sensor,” Technical Digest, Solid-State Sensor, Actuator, and Microsystems Workshop, Hilton Head Island, South Carolina, June 2004, pp. 344-347.
D. J. Young and W. H. Ko, “A High-Performance Strain Sensing Microsystem with Remote RF Power Capability” Technical Digest, The 7th International Conference on Solid-State and Integrated-Circuit Technology, Beijing, China, 2004 (Invited).
M. Suster, J. Guo, N. Chaimanonart, W. H. Ko, and D. J. Young, “High Performance Stain Sensing Microsystem,” Technical Digest, IEEE Custom Integrated Circuits Conference, Orlando, Florida, pp. 693-696, October 2004.
P. Cong, D. J. Young, and W. H. Ko, “Novel Long-Term Implantable Blood Pressure Monitoring System,” Technical Digest, IEEE Sensors Conference, Vienna, Austria, October 2004.
P. Cong, W. H. Ko, and D. J. Young, “Single Crystal 6-H Silicon Carbide Smart-Cut MEMS Fabrication Technology,” Technical Digest, IEEE Sensors Conference, Vienna, Austria, October 2004.
N. Chaimanonart, W. H. Ko, and D. J. Young, “Remote RF Powering System for MEMS Industrial Strain Sensing Applications,” Technical Digest, IEEE Sensors Conference, Vienna, Austria, October 2004.
H. Kuo, J. Guo, D. J. Young, and W. H. Ko, “Rapid Bonding of Micro Strain Sensor,” Technical Digest, IEEE Sensors Conference, Vienna, Austria, October 2004.
M. Suster, N. Chaimanonart, J. Guo, W. H. Ko, and D. J. Young, “Remote-Powered High-Performance Strain Sensing Microsystem,” to appear in Technical Digest, the 18th IEEE International Conference on Micro Electro Mechanical Systems, Miami, Florida, January 2005.
